Lead Electronics Packaging Design & Analysis Engineer
Company:
The Boeing Company
Job ID:
00000343945
Date Posted:
2023-04-04
Location:
USA - El Segundo, CA
Job Description Qualifications:
Boeing Defense Space & Security has an exciting opportunity for Lead Electronics Packaging Design Engineers to join us as part of our Electronics Packaging team located in El Segundo, CA.
Date Posted:
2021-12-22-08:00
Country:
United States of America
Location:
CA320: El Seg.-So. Campus Bldg E01 2000 East El Segundo Boulevard Building E01, El Segundo, CA, 90245 USA
The Hardware Engineering Center (HWEC) is an engineering organization that focuses on Mechanical product design, producibility, and mission assurance. It is a vital link in the integrated product development process that allows Raytheon Intelligence & Space to introduce reliable new products faster, better, and more economically.
Date Posted:
2023-10-19
Country:
United States of America
Location:
HCA09: Mission Sys (Propulsion) 3530 Branscombe Road , Fairfield, CA, 94533 USA
Position Role Type:
Onsite